Packaging FEA Engineer

Our client is a leader in RF Power Amps, PA Front End Modules and BAW Filters for 5G Smartphone phone and WLAN applications.They have grown incredibly from organic growth.They are Looking for a Packaging FEA Engineer for their RF Front end products. Will be responsible for IC/MEMS Packaging, FEA Modeling, and should have a solid understanding of PCB technology, packaging materials, material interactions, processes, mechanics, and analytical techniques. Experience with Abaqus or Python script is highly preferred.Need an MS or PhD in mechanical/civil/mechanics engineering with 5-10 years of industry experience.Requirements:• Advanced degree (MS, PhD) in mechanical/civil/mechanics engineering, background with material process engineering preferred• 5-10 yr experience in IC/MEMS packaging, and finite element analysis (FEA) / modeling (FEM) in packaging area. Experience with Abaqus/Python script preferred• Solid technical understanding of full range of PCB technology, semiconductor packaging materials, material interactions, processes, mechanics, dominant failure mechanisms and analytical techniques• Expertise in defining device level and package level FEA projects, performing simulation using various modeling techniques and material models, and interpreting modeling results• Skilled at building modeling infrastructure, and achieving automation for modeling construction and generating reports by writing scripts / codes• Experienced in modeling validation by experimentally characterizing materials, measuring in-plane and out-of-plane displacements/strains, etc.• Understanding of package qualification and reliability methods, failure analysis, statistics, control methodology is preferred• Excellent communication skill and ability to work with cross-functional teams #J-18808-Ljbffr